Electronic panel and electronic apparatus including the same

ABSTRACT

An electronic panel includes a base substrate having a first area, a second area adjacent to the first area, and a third area adjacent to the second area, a plurality of pixels in the second area, a plurality of pixel signal lines in the third area and connected to the pixels, a crack detecting pattern spaced apart from the pixels and in the first area, a first line spaced apart from the pixel signal lines, in the third area, and connected to a portion of the crack detecting pattern, and a second line spaced apart from the pixel signal lines, in the third area, connected to another portion of the crack detecting pattern, and spaced apart from the first line. The crack detecting pattern has a line-symmetrical shape with respect to a symmetry axis passing through a center of the first area.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean PatentApplication No. 10-2018-0151211, filed on Nov. 29, 2018, the entirecontents of which are hereby incorporated by reference.

BACKGROUND

The present disclosure herein relates to an electronic panel and anelectronic apparatus including the same, and more particularly, to anelectronic panel having a through hole for sensing an external input,and an electronic apparatus including the same.

An electronic apparatus is activated by an electrical signal. Theelectronic apparatus may include various electronic components such asan electronic panel and an electronic module. The electronic panel mayinclude a display unit for displaying an image and/or a sensing unit forsensing an external input. The electronic components may be electricallyconnected to each other through signal lines variously arranged.

The display unit may include a light emitting element for generating animage. The sensing unit may include sensing electrodes for sensing anexternal input. The sensing electrodes may be disposed in an activearea. The sensing unit may be designed to provide sensitivity which isuniform in the entire active area.

SUMMARY

The present disclosure may provide an electronic panel with improvedreliability and an electronic apparatus including the same.

In an embodiment of the inventive concepts, an electronic panel includesa base substrate having a first area, a second area adjacent to thefirst area, and a third area adjacent to the second area, a plurality ofpixels in the second area, a plurality of pixel signal lines in thethird area and connected to the pixels, a crack detecting pattern spacedapart from the pixels and located in the first area, a first line spacedapart from the pixel signal lines, located in the third area, andconnected to a portion of the crack detecting pattern, and a second linespaced apart from the pixel signal lines, located in the third area,connected to another portion of the crack detecting pattern, and spacedapart from the first line. The crack detecting pattern has aline-symmetrical shape with respect to a symmetry axis passing through acenter of the first area.

In an embodiment, the first area may include a module area and a linearea around the module area. The crack detecting pattern may include afirst extension portion in the line area, the first extension portionextending along an edge of the module area, and being located at a leftside of the symmetry axis, a second extension portion in the line area,the second extension portion extending along the edge of the modulearea, being spaced apart from the first extension portion, and beinglocated at a right side of the symmetry axis, a third extension portionin the line area, the third extension portion extending along the edgeof the module area, being spaced apart from the first and secondextension portions, and crossing the symmetry axis, and a firstconnecting portion and a second connecting portion that are connected toa first end of the first extension portion and a first end of the secondextension portion, respectively, and are symmetrical with respect to thesymmetry axis.

In an embodiment, the first connecting portion and the second connectingportion may be parallel to the symmetry axis.

In an embodiment, a first end of the third extension portion may beconnected to the first connecting portion, and a second end of the thirdextension portion may be connected to the second connecting portion.

In an embodiment, the first extension portion may include a plurality offirst extension portions spaced apart from each other, and the secondextension portion may include a plurality of second extension portionsspaced apart from each other. The first connecting portion may include aplurality of first connecting portions spaced apart from each other andconnected to the first extension portions, respectively, and the secondconnecting portion may include a plurality of second connecting portionsspaced apart from each other and connected to the second extensionportions, respectively.

In an embodiment, one of the first connecting portions may be connectedto a first end of the third extension portion, and one of the secondconnecting portions may be connected to a second end of the thirdextension portion.

In an embodiment, the first connecting portions may be spaced apart fromeach other along a direction parallel to the symmetry axis, and thesecond connecting portions may be spaced apart from each other along thedirection parallel to the symmetry axis.

In an embodiment, the first connecting portions and the secondconnecting portions are symmetrical with respect to the symmetry axis.

In an embodiment, the first connecting portions may be aligned with eachother along the direction parallel to the symmetry axis, and the secondconnecting portions may be aligned with each other along the directionparallel to the symmetry axis.

In an embodiment, the electronic panel may further include a holedefined in the module area and penetrating the electronic panel. Thecrack detecting pattern may be located along an edge of the hole.

In an embodiment, the electronic panel may further include at least onenon-light emitting pixel in the module area. The non-light emittingpixel may have a shape obtained by removing at least one of componentsof the pixel.

In an embodiment, the crack detecting pattern may have an open curveshape including a first end and a second end.

In an embodiment, the electronic panel may further include a firstconnection line connecting the first line and the first end of the crackdetecting pattern, and a second connection line connecting the secondline and the second end of the crack detecting pattern. The symmetryaxis may pass between the first connection line and the secondconnection line.

In an embodiment of the inventive concepts, an electronic apparatusincludes an electronic panel configured to display an image and to sensean external input, and an electronic module overlapping with theelectronic panel. The electronic panel includes a base substrateincluding a hole area in which a hole is defined, an active areaadjacent to the hole area, and a peripheral area adjacent to the activearea, and a crack detecting circuit including a crack detecting patternin the hole area and having an open curve shape along an edge of thehole, a first crack detecting line in the peripheral area and connectedto a first end of the crack detecting pattern, and a second crackdetecting line spaced apart from the first crack detecting line, in theperipheral area, and connected to a second end of the crack detectingpattern. The crack detecting pattern has a line-symmetrical shape withrespect to a symmetry axis passing through a center of the hole area.

In an embodiment, the crack detecting pattern may have a single unitarybody shape.

In an embodiment, the crack detecting pattern may include a firstextension portion at a left side of the symmetry axis, a secondextension portion at a right side of the symmetry axis, a thirdextension portion crossing the symmetry axis, a first connecting portionconnecting the first extension portion and a first end of the thirdextension portion, and a second connecting portion connecting the secondextension portion and a second end of the third extension portion. Thefirst extension portion and the second extension portion may be spacedapart from each other with the symmetry axis interposed therebetween andmay be line-symmetrical with respect to the symmetry axis. The firstconnecting portion and the second connecting portion may be spaced apartfrom each other with the symmetry axis interposed therebetween and maybe line-symmetrical with respect to the symmetry axis.

In an embodiment, a minimum distance between the third extension portionand the first extension portion may be substantially equal to a minimumdistance between the third extension portion and the second extensionportion.

In an embodiment, the crack detecting circuit may further include afirst connection line connecting the first end of the crack detectingpattern and the first crack detecting line, and a second connection lineconnecting the second end of the crack detecting pattern and the secondcrack detecting line. The symmetry axis may pass between the firstconnection line and the second connection line.

In an embodiment, the first connection line and the second connectionline may be connected to the first crack detecting line and the secondcrack detecting line via the active area.

In an embodiment, the electronic panel may further include a pluralityof sensing electrodes located at the active area and including a sensinginsulating layer, first conductive patterns located under the sensinginsulating layer, and second conductive patterns located at the sensinginsulating layer. The crack detecting pattern may be located at the samelayer as the second conductive patterns.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification. The drawings illustrateexemplary embodiments of the inventive concepts and, together with thedescription, serve to explain principles of the inventive concepts. Inthe drawings:

FIG. 1A is an assembled perspective view illustrating an electronicapparatus according to an embodiment of the inventive concepts;

FIG. 1B is an exploded perspective view illustrating the electronicapparatus of FIG. 1A;

FIG. 2 is a block diagram of the electronic apparatus of FIG. 1A;

FIG. 3A is a plan view illustrating a display unit according to anembodiment of the inventive concepts;

FIG. 3B is an enlarged view of a portion of FIG. 3A;

FIG. 3C is a plan view illustrating a sensing unit according to anembodiment of the inventive concepts;

FIG. 4 is a cross-sectional view illustrating a portion of an electronicpanel according to an embodiment of the inventive concepts;

FIG. 5A is a plan view illustrating a portion of an electronic panelaccording to an embodiment of the inventive concepts;

FIG. 5B is a plan view schematically illustrating a crack detectingcircuit;

FIGS. 6A to 6C are plan views illustrating crack detecting patternsaccording to some embodiments of the inventive concepts;

FIG. 7A is an exploded perspective view illustrating an electronicapparatus according to an embodiment of the inventive concepts;

FIG. 7B is a plan view illustrating some components of FIG. 7A;

FIG. 8 is an exploded perspective view illustrating an electronicapparatus according to an embodiment of the inventive concepts;

FIG. 9A is a plan view illustrating a portion of FIG. 8;

FIG. 9B is a cross-sectional view taken along the line I-I′ of FIG. 9A;

FIG. 10A is an exploded perspective view illustrating an electronicapparatus according to an embodiment of the inventive concepts;

FIG. 10B is a plan view schematically illustrating an area YY′ of FIG.10A; and

FIGS. 11A and 11B are cross-sectional views illustrating electronicpanels according to some embodiments of the inventive concepts.

DETAILED DESCRIPTION

The inventive concepts now will be described more fully hereinafter withreference to the accompanying drawings, in which various embodiments areshown. The inventive concepts may, however, be embodied in manydifferent forms, and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scopes of the inventive concepts to those skilled in the art.Like reference numerals refer to like elements throughout.

It will be understood that when an element such as a layer, region orsubstrate is referred to as being “on” another element, it can bedirectly on the other element or intervening elements may be present. Incontrast, the term “directly” means that there are no interveningelements. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “Or” means “and/or.” As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. It will be further understood that the terms “comprises”and/or “comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings herein.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system).

Exemplary embodiments are described herein with reference tocross-sectional illustrations and/or plane illustrations that areidealized exemplary illustrations. In the drawings, the thicknesses oflayers and regions are exaggerated for clarity. Accordingly, variationsfrom the shapes of the illustrations as a result, for example, ofmanufacturing techniques and/or tolerances, are to be expected. Thus,exemplary embodiments should not be construed as limited to the shapesof regions illustrated herein but are to include deviations in shapesthat result, for example, from manufacturing. For example, an etchingregion illustrated as a rectangle will, typically, have rounded orcurved features. Thus, the regions illustrated in the figures areschematic in nature and their shapes are not intended to illustrate theactual shape of a region of a device and are not intended to limit thescope of exemplary embodiments.

Hereinafter, exemplary embodiments of the inventive concepts will bedescribed in detail with reference to the accompanying drawings.

FIG. 1A is an assembled perspective view illustrating an electronicapparatus according to an embodiment of the inventive concepts. FIG. 1Bis an exploded perspective view illustrating the electronic apparatus ofFIG. 1A. FIG. 2 is a block diagram of the electronic apparatus of FIG.1A. Hereinafter, an embodiment of the inventive concepts will bedescribed with reference to FIGS. 1A-2.

An electronic apparatus EA may be activated by an electrical signal. Theelectronic apparatus EA may be realized as various embodiments. Forexample, the electronic apparatus EA may be realized as a tablet, anotebook computer, a personal computer, a smart television, a smartphone or any other suitable electronic device. In the presentembodiment, the smart phone is illustrated as an example of theelectronic apparatus EA.

As illustrated in FIG. 1A, the electronic apparatus EA may display animage IM on its front surface FS. The front surface FS may be parallelto a plane defined by a first direction DR1 and a second direction DR2.The front surface FS may include a transmission area TA and a bezel areaBZA adjacent to the transmission area TA.

The electronic apparatus EA may display the image IM in the transmissionarea TA. The image IM may include at least one of a static image or adynamic image. A clock image and a plurality of icons are illustrated asan example of the image IM in FIG. 1A.

The transmission area TA may have a quadrilateral shape (e.g., arectangular shape) parallel to the first and second directions DR1 andDR2. However, embodiments of the inventive concepts are not limitedthereto. In other embodiments, the shape of the transmission area TA maybe variously modified.

The bezel area BZA may be adjacent to the transmission area TA. Thebezel area BZA may surround the transmission area TA when viewed in aplan view. However, embodiments of the inventive concepts are notlimited thereto. In other embodiments, the bezel area BZA may beadjacent to only one side of the transmission area TA or may be omitted.The electronic apparatus EA according to the embodiment of the inventiveconcepts may be variously embodied and is not limited to a specificembodiment.

A normal direction of the front surface FS may correspond to a thicknessdirection DR3 (hereinafter, referred to as a third direction) of theelectronic apparatus EA. In the present embodiment, a front surface (ora top surface) and a rear surface (or a bottom surface) of each membermay be defined based on a direction (e.g., the third direction DR3) inwhich the image IM is displayed. The front surface and the rear surfacemay be opposite to each other in the third direction DR3.

However, directions indicated by the first to third directions DR1, DR2and DR3 may be relative concepts and may be changed into otherdirections. Hereinafter, the first to third directions are thedirections indicated by the first to third directions DR1, DR2 and DR3illustrated in FIG. 1A, respectively.

In some embodiments, the electronic apparatus EA may sense a user'sinput TC applied from the outside. For example, the user's input TC mayinclude at least one of various kinds of external inputs such as a part(e.g., a finger) of a user's body, light, heat, and pressure. Inaddition, the electronic apparatus EA may sense a proximity input aswell as an input touched to the electronic apparatus EA.

In the present embodiment, a user's hand applied to the front surface FSis illustrated as an example of the user's input TC. However,embodiments of the inventive concepts are not limited thereto. In otherwords, the user's input TC may be provided in various forms, asdescribed above. In certain embodiments, the electronic apparatus EA mayalso sense the user's input TC applied to a side surface and/or a rearsurface of the electronic apparatus EA, on the basis of a structure ofthe electronic apparatus EA.

The electronic apparatus EA may include a window 100, an electronicpanel 200, a circuit board 300, an electronic module 400, and an outercase 500. The window 100 and the outer case 500 may be coupled to eachother to form the exterior of the electronic apparatus EA.

The window 100 may be disposed on the electronic panel 200 to cover afront surface IS of the electronic panel 200. The window 100 may includean optically transparent insulating material. For example, the window100 may include glass or plastic. The window 100 may have asingle-layered or multi-layered structure. For example, the window 100may have a stack structure including a plurality of plastic filmscoupled to each other by an adhesive or may have a stack structure thatincludes a glass substrate and a plastic film coupled to each other byan adhesive.

The window 100 may include a front surface FS exposed to the outside.The front surface FS of the electronic apparatus EA may be substantiallydefined by the front surface FS of the window 100.

The transmission area TA may be optically transparent. The transmissionarea TA may have a shape corresponding to a shape of an active area AA.For example, the transmission area TA may overlap with the whole or atleast a portion of the active area AA. The image IM displayed in theactive area AA of the electronic panel 200 may be visible to the outsidethrough the transmission area TA.

A light transmittance of the bezel area BZA may be less than a lighttransmittance of the transmission area TA. The bezel area BZA may definea shape of the transmission area TA. The bezel area BZA may be adjacentto the transmission area TA and may surround or partially surround thetransmission area TA in a plan view.

The bezel area BZA may have any suitable color (e.g., a predeterminedcolor). When the window 100 includes a glass or plastic substrate, thebezel area BZA may have a color layer printed or deposited on a surfaceof the glass or plastic substrate. Alternatively, the bezel area BZA maybe formed by coloring a corresponding area of the glass or plasticsubstrate.

The bezel area BZA may cover a peripheral area NAA of the electronicpanel 200 to prevent the peripheral area NAA from being visible to theoutside. However, embodiments of the inventive concepts are not limitedthereto. In another embodiment of the inventive concepts, the bezel areaBZA may be omitted in the window 100.

The electronic panel 200 may display the image IM and may sense anexternal input TC (e.g., the user's input TC). The electronic panel 200may include the front surface IS that includes the active area AA andthe peripheral area NAA. The active area AA may be an area that isactivated by an electrical signal.

In the present embodiment, the active area AA may be an area in whichthe image IM is displayed and may also be an area in which the externalinput TC is sensed. The transmission area TA may overlap with at leastthe active area AA. For example, the transmission area TA may overlapwith the whole (i.e., the entirety of) or at least a portion of theactive area AA. Thus, a user may view the image IM through thetransmission area TA and/or may provide the external input TC throughthe transmission area TA. However, embodiments of the inventive conceptsare not limited thereto. In another embodiment, an area for displayingthe image IM and an area for sensing the external input TC may beseparated from each other in the active area AA.

The peripheral area NAA may be covered by the bezel area BZA. Theperipheral area NAA may be adjacent to the active area AA. Theperipheral area NAA may surround or partially surround the active areaAA when viewed in a plan view. A driving circuit and/or driving linesfor driving the active area AA may be disposed in the peripheral areaNAA.

Various signal lines, pads PD and/or electronic components for providingelectrical signals to the active area AA may be disposed in theperipheral area NAA. The peripheral area NAA may be covered by the bezelarea BZA and thus may not be visible to the outside.

In the present embodiment, the electronic panel 200 may be assembled ina flat state where the active area AA and the peripheral area NAA facethe window 100. However, embodiments of the inventive concepts are notlimited thereto. In another embodiment, a portion of the peripheral areaNAA of the electronic panel 200 may be bent. In this case, a portion ofthe peripheral area NAA may face the rear surface of the electronicapparatus EA, and thus the bezel area BZA in the front surface of theelectronic apparatus EA may be reduced. In still another embodiment, theelectronic panel 200 may be assembled in a state where a portion of theactive area AA is also bent. In yet another embodiment, the peripheralarea NAA may be omitted in the electronic panel 200.

Referring to FIG. 2, the electronic panel 200 may include a display unit210 and a sensing unit 220. The display unit 210 may be a component thatsubstantially generates the image IM. The image IM generated from thedisplay unit 210 may be visible to a user through the transmission areaTA.

The sensing unit 220 may sense the external input TC applied from theoutside. As described above, the sensing unit 220 may sense the externalinput TC provided to the window 100.

A hole area HA (or a first area) may be defined in the electronic panel200. A transmittance per unit area of the hole area HA may be higherthan a transmittance per unit area of the active area AA (or a secondarea). The hole area HA may be defined at a position overlapping withthe electronic module 400 in a plan view.

At least a portion of the hole area HA may be surrounded by the activearea AA when viewed in a plan view. In the present embodiment, the holearea HA may be spaced apart from the peripheral area NAA (or a thirdarea). In FIG. 1B, the hole area HA is defined in the active area AAsuch that an entire edge of the hole area HA is surrounded by the activearea AA.

The electronic panel 200 may include a hole MH that is defined in thehole area HA and penetrates the electronic panel 200. The hole MH maypenetrate at least one of the display unit 210 or the sensing unit 220.The edge of the hole area HA may be spaced apart from an edge of thehole MH (e.g., spaced apart by a predetermined distance) and may extendalong the edge of the hole MH. The edge of the hole area HA may have ashape corresponding to a shape of the edge of the hole MH.

The circuit board 300 may be connected to the electronic panel 200. Thecircuit board 300 may include a flexible board CF and a main board MB.The flexible board CF may include an insulating film and conductivelines mounted on the insulating film. The conductive lines may beconnected to the pads PD and thus may electrically connect the circuitboard 300 and the electronic panel 200.

In the present embodiment, the flexible board CF may be assembled in abent state. Thus, the main board MB may be disposed on a rear surface ofthe electronic panel 200 and may be stably located in a space providedby the outer case 500. In another embodiment, the flexible board CF maybe omitted. In this case, the main board MB may be connected directly tothe electronic panel 200.

The main board MB may include signal lines and electronic components.The electronic components may be electrically connected to theelectronic panel 200 through the signal lines. The electronic componentsmay generate various kinds of electrical signals (e.g., a signal forgenerating the image IM and/or a signal for sensing the external inputTC) and/or may process a sensed signal. The main board MB may beprovided in plurality to correspond to the electrical signals for thegeneration and the process, respectively.

In the electronic apparatus EA according to an embodiment of theinventive concepts, a driving circuit for providing electrical signalsto the active area AA may be mounted directly on the electronic panel200. In this case, the driving circuit may be mounted in a chip form ormay be formed together with pixels PX. In this case, an area (or size)of the circuit board 300 may be reduced or the circuit board 300 may beomitted. In certain embodiments, the electronic apparatus EA may bevariously embodied and may not be limited to one embodiment.

The electronic module 400 may be disposed under the window 100. Theelectronic module 400 may overlap with the hole MH and the hole area HAwhen viewed in a plan view (e.g., in a direction normal to the frontsurface FS). The electronic module 400 may receive an external inputtransferred through the hole area HA and/or may provide an output signalthrough the hole area HA.

A receiving part for receiving the external input and/or an output partfor providing the output signal in the electronic module 400 may overlapwith the hole area HA when viewed in a plan view (e.g., in a directionnormal to the front surface FS). The whole or a portion of theelectronic module 400 may be received in the hole area HA or the holeMH. According to the embodiment of the inventive concepts, because theelectronic module 400 overlaps with the active area AA, an increase inthe bezel area BZA may be prevented.

Referring to FIG. 2, the electronic apparatus EA may include theelectronic panel 200, a power supply module PM, a first electronicmodule EM1, and a second electronic module EM2. The electronic panel200, the power supply module PM, the first electronic module EM1 and thesecond electronic module EM2 may be electrically connected to eachother. The display unit 210 and the sensing unit 220 may be componentsof the electronic panel 200, and are illustrated in FIG. 2.

The first electronic module EM1 and the second electronic module EM2 mayinclude various functional modules for operating the electronicapparatus EA. The first electronic module EM1 may be mounted directly ona motherboard electrically connected to the electronic panel 200.Alternatively, the first electronic module EM1 may be mounted on anadditional board so as to be electrically connected to the motherboardthrough a connector.

The first electronic module EM1 may include a control module CM, awireless communication module TM, an image input module IIM, a soundinput module AIM, a memory MM, and an external interface IF. In anembodiment, some of the components (i.e., the modules) may not bemounted on the motherboard but may be electrically connected to themotherboard through a flexible circuit board.

The control module CM may control overall operations of the electronicapparatus EA. The control module CM may include a microprocessor. Forexample, the control module CM may activate or deactivate the electronicpanel 200. The control module CM may control other module(s) (e.g., theimage input module IIM, the sound input module AIM, etc.) on the basisof an external input (e.g., a touch signal) received from the electronicpanel 200.

The wireless communication module TM may transmit/receive a wirelesssignal to/from other terminal(s) by using Bluetooth or Wi-Fi. Thewireless communication module TM may transmit/receive a voice signal byusing a general communication line. The wireless communication module TMmay include a transmitter TM1 that is configured to modulate a signal tobe transmitted and to transmit the modulated signal, and a receiver TM2that is configured to demodulate a received signal.

The image input module IIM may process image signals to convert theimage signals into image data usable in the electronic panel 200. Thesound input module AIM may receive an external sound signal through amicrophone in a recording mode or a voice recognition mode and mayconvert the received sound signal into electrical sound data.

The external interface IF may be connected to and interface with anexternal charger, a cable/wireless data port, and/or a card socket(e.g., a memory card or a SIM/UIM card).

The second electronic module EM2 may include a sound output module AOM,a light emitting module LM, a light receiving module LRM, and a cameramodule CMM. The components of the second electronic module EM2 may bemounted directly on the motherboard or may be mounted on an additionalboard so as to be electrically connected to the electronic panel 200and/or the first electronic module EM1 through a connector (not shown).

The sound output module AOM may convert sound data received from thewireless communication module TM and/or sound data stored in the memoryMM and may output the converted sound data to the outside.

The light emitting module LM may generate light and may output thegenerated light. The light emitting module LM may output infrared light.For example, the light emitting module LM may include a light emittingdiode (LED) element. For example, the light receiving module LRM maysense infrared light. The light receiving module LRM may be activatedwhen sensing the infrared light of a reference level (e.g., apredetermined level) or more. The light receiving module LRM may includea CMOS sensor. After the infrared light generated by the light emittingmodule LM is outputted, the infrared light may be reflected by anexternal object (e.g., a user's finger or face), and the reflectedinfrared light may be incident to the light receiving module LRM. Thecamera module CMM may acquire an external image.

The electronic module 400 according to some embodiments of the inventiveconcepts may include at least one of the components of the first andsecond electronic modules EM1 and EM2. For example, the electronicmodule 400 may include at least one of the camera, the speaker, thelight sensing sensor, or the heat sensing sensor. The electronic module400 may sense an external object through the hole area HA and/or mayprovide a sound signal (e.g., a voice) to the outside through the holearea HA. In certain embodiments, the electronic module 400 may include aplurality of components. However, the inventive concepts are not limitedto a specific embodiment.

The electronic module 400 overlapping with the hole area HA may easilyrecognize an external object through the hole area HA and/or may easilytransmit an output signal generated from the electronic module 400 tothe outside. Although not shown in the drawings, the electronicapparatus EA according to an embodiment may further include atransparent member disposed between the electronic module 400 and theelectronic panel 200. The transparent member may be an opticallytransparent film such that the external input provided through the holeMH is transmitted to the electronic module 400 through the transparentmember. The transparent member may be adhered to the rear surface of theelectronic panel 200 or may be disposed between the electronic panel 200and the electronic module 400 without an additional adhesive layer. Incertain embodiments, the structure of the electronic apparatus EA may bevariously modified or changed and may not be limited to one embodiment.

According to the embodiment of the inventive concepts, the electronicmodule 400 may overlap with the transmission area TA when viewed in aplan view (e.g., in a direction normal to the front surface FS). As aresult, an increase in the bezel area BZA by reception of the electronicmodule 400 may be prevented, and thus the aesthetics of the electronicapparatus EA may be improved.

FIG. 3A is a plan view illustrating a display unit according to anembodiment of the inventive concepts. FIG. 3B is an enlarged view of aportion of FIG. 3A. FIG. 3C is a plan view illustrating a sensing unitaccording to an embodiment of the inventive concepts. FIG. 4 is across-sectional view illustrating a portion of an electronic panelaccording to an embodiment of the inventive concepts.

FIG. 3A schematically illustrates a signal circuit diagram, and FIG. 3Bis an enlarged view of an area XX′ of FIG. 1B. For the purpose of easeand convenience in description and illustration, some components areomitted in FIGS. 3A-4. Hereinafter, an embodiment of the inventiveconcepts will be described with reference to FIGS. 3A-4.

As illustrated in FIG. 3A, the display unit 210 may include a basesubstrate BS, a plurality of pixels PX, a plurality of signal lines GL,DL and PL, and a plurality of display pads DPD.

The active area AA and the peripheral area NAA may be areas provided bythe base substrate BS. The base substrate BS may include an insulatingsubstrate. For example, the base substrate BS may include a glasssubstrate, a plastic substrate, or a combination thereof.

The signal lines GL, DL and PL may be connected to the pixels PX and maytransmit electrical signals to the pixels PX. A scan line GL, a dataline DL, and a power line PL of the signal lines that are included inthe display unit 210 are illustrated as an example in FIG. 3A. However,embodiments of the inventive concepts are not limited thereto. Incertain embodiments, the signal lines GL, DL and PL may further includeat least one of a power supply line, an initialization voltage line, oran emission control line.

The pixels PX may be disposed in the active area AA. In the presentembodiment, an enlarged circuit diagram of one of the pixels PX isillustrated as an example in FIG. 3A. The pixel PX may include a firstthin film transistor TR1, a capacitor CP, a second thin film transistorTR2, and a light emitting element EE. The first thin film transistor TR1may be a switching element configured to control on/off of the pixel PX.The first thin film transistor TR1 may transmit or block a data signalprovided through the data line DL in response to a scan signal providedthrough the scan line GL.

The capacitor CP may be connected to the first thin film transistor TR1and the power line PL. The capacitor CP may be charged with a charge(e.g., voltage) corresponding to a difference between the data signaltransmitted from the first thin film transistor TR1 and a first powersource signal provided through the power line PL.

The second thin film transistor TR2 may be connected to the first thinfilm transistor TR1, the capacitor CP, and the light emitting elementEE. The second thin film transistor TR2 may control a driving current,flowing through the light emitting element EE, in response to the amountof charge (e.g., voltage) stored in the capacitor CP. A turn-on time ofthe second thin film transistor TR2 may be determined depending on theamount of the charge (e.g., voltage) stored in the capacitor CP. Thesecond thin film transistor TR2 may provide the first power sourcesignal transmitted through the power line PL to the light emittingelement EE for the turn-on time.

The light emitting element EE may generate light or control the amountof light according to an electrical signal. For example, the lightemitting element EE may include an organic light emitting element, aquantum dot light emitting element, an electrophoretic element, anelectrowetting element, or any other suitable element.

The light emitting element EE may be connected to a power sourceterminal VSS and may receive a power source signal (hereinafter,referred to as a second power source signal) different from the firstpower source signal provided from the power line PL. The driving currentcorresponding to a difference between the second power source signal andthe electrical signal provided from the second thin film transistor TR2may flow through the light emitting element EE, and the light emittingelement EE may generate light corresponding to the driving current.However, embodiments of the inventive concepts are not limited thereto.The components of each of the pixels PX may be variously modified orchanged and may be variously arranged in any suitable manner.

The pixels PX may be disposed around the hole MH and may be disposed tosurround or partially surround the hole MH in a plan view (e.g., adirection parallel to the front surface FS). In FIG. 3B, the hole areaHA is illustrated by a dotted line for the purpose of ease andconvenience in description and illustration. The area XX′ includes anarea in which the hole MH is defined. Hereinafter, an area of thedisplay unit 210 in which the hole MH is disposed will be described withreference to FIG. 3B.

As described above, the hole MH may be defined in the active area AA.Thus, some of the pixels PX may be disposed adjacent to the hole MH.Some of the pixels PX may surround or partially surround the hole MHwhen viewed in a plan view.

A recess pattern GV may be defined in the hole area HA. The recesspattern GV may extend along the edge of the hole MH in a plan view(e.g., in a direction normal to the front surface FS) and may have acircular ring shape surrounding the hole MH in the present embodiment.However, embodiments of the inventive concepts are not limited thereto.In other embodiments, the recess pattern GV may have a different shapefrom that of the hole MH. For example, the recess pattern GV may have apolygonal shape, an elliptical shape, or a closed loop shape of which atleast a portion is curved. Alternatively, the recess pattern GV may havea shape including a plurality of patterns separated from each other.

The recess pattern GV may correspond to a portion recessed from thefront surface of the display unit 210 and may block a path of moistureand/or oxygen permeating to the pixels PX through the hole MH. This willbe described later in more detail.

A plurality of signal lines SL1 and SL2 connected to the pixels PX maybe disposed in the hole area HA. The signal lines SL1 and SL2 may beconnected to the pixels PX via the hole area HA. A first signal line SL1and a second signal line SL2 of the plurality of signal lines connectedto the pixels PX are illustrated as an example in FIG. 3B for thepurpose of ease and convenience in description.

The first signal line SL1 may extend in the first direction DR1. Thefirst signal line SL1 may be connected to the pixels PX which arearranged along the first direction DR1 to constitute a same row. Forexample, the first signal line SL1 may correspond to the scan line GL.

Some of the pixels PX connected to the first signal line SL1 may bedisposed at a left side of the hole MH, and others thereof may bedisposed at a right side of the hole MH. Thus, the pixels PX in the samerow connected to the first signal line SL1 may be turned on/off bysubstantially the same scan signal even though one or more pixels in thesame row are omitted due to the hole MH.

The second signal line SL2 may extend in the second direction DR2. Thesecond signal line SL2 may be connected to the pixels PX which arearranged in the second direction DR2 to constitute a same column. Forexample, the second signal line SL2 may correspond to the data line DL.

Some of the pixels PX connected to the second signal line SL2 may bedisposed at a top side of the hole MH, and others thereof may bedisposed at a bottom side of the hole MH. Thus, the pixels PX in thesame column connected to the second signal line SL2 may receive the datasignal through the same line even though one or more pixels in the samecolumn are omitted due to the hole MH.

In certain embodiments, the electronic panel 200 may further include aconnecting pattern disposed in the hole area HA. In this case, the firstsignal line SL1 overlapping with the hole area HA may be cut. The cutportions of the first signal line SL1 may be connected to each otherthrough the connecting pattern. Likewise, the second signal line SL2overlapping with the hole area HA may be cut, and the cut portions ofthe second signal line SL2 may be connected to each other through theconnecting pattern.

Referring again to FIG. 3A, a power pattern VDD may be disposed in theperipheral area NAA. In the present embodiment, the power pattern VDDmay be connected to a plurality of the power lines PL. Because thedisplay unit 210 includes the power pattern VDD, the same first powersource signal may be provided to the plurality of pixels PX.

The display pads DPD may include a first pad P1 and a second pad P2. Thefirst pad P1 may be provided in plurality, and the plurality of firstpads P1 may be connected to the data lines DL, respectively. The secondpad P2 may be connected to the power pattern VDD and thus may beelectrically connected to the power lines PL. The display unit 210 mayprovide electrical signals received from the outside (e.g., an externaldevice) through the display pads DPD to the pixels PX. In an embodiment,the display pads DPD may further include pads for receiving otherelectrical signals in addition to the first pad P1 and the second padP2. However, the inventive concepts are not limited to one embodiment.

Referring to FIG. 3C, the sensing unit 220 may be disposed on thedisplay unit 210. The sensing unit 220 may sense the external input TC(see FIG. 1A) to obtain information on a position and/or strength of theexternal input TC. The sensing unit 220 may include a plurality of firstsensing electrodes TE1, a plurality of second sensing electrodes TE2, aplurality of sensing lines TL1, TL2 and TL3, and a plurality of sensingpads T1, T2 and T3.

The first sensing electrodes TE1 and the second sensing electrodes TE2may be disposed in the active area AA. The sensing unit 220 may obtaininformation on the external input TC by using a change in capacitancebetween the first sensing electrodes TE1 and the second sensingelectrodes TE2.

The first sensing electrodes TE1 may be arranged in the first directionDR1 and may extend in the second direction DR2. Each of the firstsensing electrodes TE1 may include a first main pattern SP1 and a firstconnection pattern BP1. In an embodiment, the first sensing electrodeTE1 adjacent to the hole area HA may further include a first adjacentpattern SP1H.

The first main pattern SP1 may be disposed in the active area AA. Thefirst main pattern SP1 may be spaced apart from the hole MH. The firstmain pattern SP1 may have a suitable shape (e.g., predetermined shape)and may have a first area (or first size). In the present embodiment,the first main pattern SP1 may have a diamond or lozenge shape. However,embodiments of the inventive concepts are not limited thereto. In otherembodiments, the shape of the first main pattern SP1 may be variouslymodified.

The first adjacent pattern SP1H may be adjacent to the hole area HA. Thefirst adjacent pattern SP1H may have a second area (or second size) lessthan the first area of the first main pattern SP1. The first adjacentpattern SP1H may have a shape obtained by removing a portion overlappingwith the hole area HA from the same shape (e.g., the diamond shape) asthe first main pattern SP1.

In the present embodiment, the first connection pattern BP1 may extendin the second direction DR2. The first connection pattern BP1 may beconnected to the first main pattern SP1. The first connection patternBP1 may be disposed between two first main patterns SP1 to connect thetwo first main patterns SP1. In an embodiment, the first connectionpattern BP1 may be disposed between the first main pattern SP1 and thefirst adjacent pattern SP1H to connect the first main pattern SP1 andthe first adjacent pattern SP1H.

The second sensing electrodes TE2 may be arranged in the seconddirection DR2 and may extend in the first direction DR1. Each of thesecond sensing electrodes TE2 may include a second main pattern SP2 anda second connection pattern BP2. In an embodiment, the second sensingelectrode TE2 adjacent to the hole area HA may further include a secondadjacent pattern SP2H.

The second main pattern SP2 may be spaced apart from the hole MH. Thesecond main pattern SP2 may be spaced apart from the first main patternSP1. In the present embodiment, the first main pattern SP1 and thesecond main pattern SP2 may be spaced apart from each other when viewedin a cross-sectional view. The first main pattern SP1 and the secondmain pattern SP2 may not be in contact with each other and thus maytransmit/receive independent electrical signals.

In the present embodiment, the second main pattern SP2 may have the sameshape as the first main pattern SP1. For example, the second mainpattern SP2 may have a diamond or lozenge shape. However, embodiments ofthe inventive concepts are not limited thereto. In other embodiments,the shape of the second main pattern SP2 may be variously modified in asuitable manner.

The second adjacent pattern SP2H may be adjacent to the hole MH. Thesecond adjacent pattern SP2H may have an area (or size) less than anarea (or size) of the second main pattern SP2. The second adjacentpattern SP2H may have a shape obtained by removing a portion overlappingwith the hole MH or the hole area HA from the same shape (e.g., the samediamond shape) as the second main pattern SP2.

In the present embodiment, the second connection pattern BP2 may extendin the first direction DR1. The second connection pattern BP2 may beconnected to the second main pattern SP2. The second connection patternBP2 may be disposed between two second main patterns SP2 to connect thetwo second main patterns SP2. In an embodiment, the second connectionpattern BP2 may be disposed between the second main pattern SP2 and thesecond adjacent pattern SP2H to connect the second main pattern SP2 andthe second adjacent pattern SP2H.

The sensing lines TL1, TL2 and TL3 may be disposed in the peripheralarea NAA. The sensing lines TL1, TL2 and TL3 may include first sensinglines TL1, second sensing lines TL2, and third sensing lines TL3.

The first sensing lines TL1 are connected to the first sensingelectrodes TE1, respectively. In the present embodiment, the firstsensing lines TL1 may be connected to bottom ends of the first sensingelectrodes TE1, respectively, when viewed in a plan view (e.g., in adirection normal to the front surface FS with the hole MH located at thetop right of the electronic apparatus EA as depicted in FIG. 3C).

Each of the second sensing lines TL2 are connected to a first end ofeach of the second sensing electrodes TE2. In the present embodiment,the second sensing lines TL2 may be connected to a second end each ofthe second sensing electrodes TE2, respectively.

The third sensing lines TL3 are connected to top ends of the firstsensing electrodes TE1, respectively, when viewed in a plan view (e.g.,in a direction normal to the front surface FS as depicted in FIG. 3C).According to the embodiments of the inventive concepts, the firstsensing electrodes TE1 may be connected to the first sensing lines TL1and the third sensing lines TL3, respectively. Thus, sensitivity of thefirst sensing electrodes TE1, which extend longer than the secondsensing electrodes TE2, may be uniformly maintained. However,embodiments of the inventive concepts are not limited thereto. Inanother embodiment, the third sensing lines TL3 may be omitted in thesensing unit 220.

The sensing pads T1, T2 and T3 may be disposed in the peripheral areaNAA. The sensing pads T1, T2 and T3 may include first sensing pads T1,second sensing pads T2, and third sensing pads T3. The first sensingpads T1 may be connected to the first sensing lines TL1, respectively,to provide external signals to the first sensing electrodes TE1. Thesecond sensing pads T2 may be connected to the second sensing lines TL2,respectively, and may be electrically connected to the second sensingelectrodes TE2, respectively. The third sensing pads T3 may be connectedto the third sensing lines TL3, respectively.

In an embodiment of the inventive concepts, the sensing unit 220 mayfurther include a crack detecting circuit HCC (which is depicted inFIGS. 5B, 6A-6C, and 7B). The crack detecting circuit HCC may receive anelectrical signal independent of the first sensing electrodes TE1 andthe second sensing electrodes TE2. The crack detecting circuit HCC mayinclude a crack detecting pattern HCP, a crack detecting line HCL and aconnection line BRH, which are connected to each other.

The crack detecting pattern HCP may be disposed in the hole area HA. Thecrack detecting pattern HCP may extend along the edge of the hole areaHA in the hole area HA. In the present embodiment, the crack detectingpattern HCP may have a shape surrounding the edge of the hole MH.

The crack detecting pattern HCP may include a conductive material (e.g.,the crack detecting pattern HCP may have conductivity). In the presentembodiment, the crack detecting pattern HCP may have a single unitarybody shape.

The crack detecting line HCL may be disposed in the peripheral area NAA.In the present embodiment, the crack detecting line HCL may be disposedoutside the first to third sensing lines TL1, TL2 and TL3 when viewed ina plan view (e.g., from a direction normal to the front surface FS).

The crack detecting line HCL may be electrically connected to the crackdetecting pattern HCP. The crack detecting line HCL may include a firstline HCL1 and a second line HCL2, which are spaced apart from eachother.

Each of the first line HCL1 and the second line HCL2 may be connected tocorresponding ones of first to fourth pads H11, H12, H21 and H22. Forexample, a first end of the first line HCL1 may be connected to thesecond pad H12, and a first end of the second line HCL2 may be connectedto the first pad H11. For example, the first pad H11 and the second padH12 may be disposed at a left side of the area in which the display padsDPD are disposed.

For example, a second end of the first line HCL1 may be connected to thethird pad H21, and a second end of the second line HCL2 may be connectedto the fourth pad H22. For example, the third pad H21 and the fourth padH22 may be disposed at a right side of the area in which the displaypads DPD are disposed. The first and second pads H11 and H12 may bespaced apart from the third and fourth pads H21 and H22 with the displaypads DPD interposed therebetween.

According to an embodiment of the inventive concepts, the crackdetecting circuit HCC may be used to check or determine whether damage(e.g., a crack) has occurred in the hole area HA and/or the peripheralarea NAA. In the crack detecting circuit HCC, the first pad H11 and thethird pad H21 may be input terminals, and the second pad H12 and thefourth pad H22 may be output terminals.

An electrical signal received through the first pad H11 may pass throughthe crack detecting pattern HCP via the second line HCL2. Thereafter,the electrical signal outputted from the crack detecting pattern HCP maybe outputted to the second pad H12 via the first line HCL1.

Likewise, an electrical signal received through the third pad H21 maypass through the crack detecting pattern HCP via the first line HCL1.Thereafter, the electrical signal outputted from the crack detectingpattern HCP may be outputted to the fourth pad H22 via the second lineHCL2.

For example, when a level of a signal sensed from each of the second andfourth pads H12 and H22 is lower than a level of a reference signal oris zero (e.g., a poor signal), the first and second lines HCL1 and HCL2may be damaged or the crack detecting pattern HCP may be damaged. Thus,it is possible to check or determine whether a crack has occurred in thehole area HA or not.

When only a signal received from one of the second and fourth pads H12and H22 is not a poor signal, the crack detecting line HCL may bedamaged. Thus, it is possible to check or determine whether a crack hasoccurred in the peripheral area NAA or not. However, embodiments of theinventive concepts are not limited thereto. In certain embodiments, thefirst and third pads H11 and H21 may function as the output terminals,and the second and fourth pads H12 and H22 may function as inputterminals.

The connection line BRH may include a first connection line BRH1 and asecond connection line BRH2. The first connection line BRH1 may connectthe first line HCL1 and the crack detecting pattern HCP. The secondconnection line BRH2 may connect the second line HCL2 and the crackdetecting pattern HCP.

In the present embodiment, the connection line BRH may be spaced apartfrom an overlapping pattern of the first sensing electrode TE1 or thesecond sensing electrode TE2 when viewed in a cross-sectional view ormay be spaced apart from the first sensing electrode TE1 or the secondsensing electrode TE2 when viewed in a plan view (e.g., viewed from adirection normal to the front surface FS as depicted in FIG. 3C). Thus,the connection line BRH may be electrically insulated from the firstsensing electrode TE1 or the second sensing electrode TE2. This will bedescribed later in more detail.

According to the embodiment of the inventive concepts, the sensing unit220 may further include the crack detecting circuit HCC, and thus it ispossible to sense or determine whether a defect (e.g., a crack) hasoccurred in the sensing unit 220 (in particular, the hole area HA) ornot. As a result, reliability of the electronic apparatus EA may beimproved, and a defect of the electronic apparatus EA may be checked ordetermined without a separate inspection circuit or device, therebyincreasing process efficiency.

FIG. 4 is a cross-sectional view illustrating a portion of an electronicpanel according to an embodiment of the inventive concepts. Hereinafter,an embodiment of the inventive concepts will be described with referenceto FIG. 4. Meanwhile, the same components as described with reference toFIGS. 1A-3C may be indicated by the same reference numerals ordesignators, and the descriptions thereto may be omitted for the purposeof ease and convenience in description.

As illustrated in FIG. 4, the display unit 210 and the sensing unit 220may be stacked in the third direction DR3 in the electronic panel 200.The display unit 210 may include the base substrate BS, the pixel PX(e.g., the pixel PX of FIG. 3A), a plurality of insulating layers 10,20, 30, 40 and 50, and an encapsulation layer 60.

As described above, the base substrate BS may be an insulatingsubstrate. For example, the base substrate BS may include a plasticsubstrate or a glass substrate.

In the present embodiment, the second thin film transistor (hereinafter,referred to as a thin film transistor TR) and the light emitting elementEE of the pixel PX depicted in the circuit diagram of FIG. 3A areillustrated as an example in FIG. 4. The insulating layers 10, 20, 30,40 and 50 may include first to fifth insulating layers 10, 20, 30, 40and 50 sequentially stacked. Each of the first to fifth insulatinglayers 10, 20, 30, 40 and 50 may include an organic material and/or aninorganic material and may have a single-layered or multi-layeredstructure.

The first insulating layer 10 may be disposed on the base substrate BSand cover a front surface of the base substrate BS. The first insulatinglayer 10 may include a barrier layer 11 and/or a buffer layer 12. Thus,the first insulating layer 10 may substantially prevent oxygen and/ormoisture from permeating into the pixel PX through the base substrate BSand/or may reduce surface energy of the base substrate BS such that thepixel PX is stably formed on the base substrate BS.

However, embodiments of the inventive concepts are not limited thereto.In other embodiments, at least one of the barrier layer 11 or the bufferlayer 12 may be omitted or may have a plurality of stacked layers.

The thin film transistor TR may be disposed on the first insulatinglayer 10. The thin film transistor TR may include a semiconductorpattern AL, a control electrode CE, an input electrode IE, and an outputelectrode OE. The semiconductor pattern AL may be disposed on the firstinsulating layer 10. The semiconductor pattern AL may include asemiconductor material. The control electrode CE may be spaced apartfrom the semiconductor pattern AL with the second insulating layer 20interposed therebetween. The control electrode CE may be connected tothe first thin film transistor TR1 (see FIG. 3A) and a first electrodeof the capacitor CP (see FIG. 3A).

The input electrode IE and the output electrode OE may be disposed onthe third insulating layer 30 and may be spaced apart from each otherwhen viewed in a plan view. The input electrode IE and the outputelectrode OE may penetrate the second and third insulating layers 20 and30 so as to be connected to one side portion and another side portion ofthe semiconductor pattern AL, respectively.

The display unit 210 according to an embodiment of the inventiveconcepts may further include an upper electrode UE. In the presentembodiment, the third insulating layer 30 may include a lower layer 31and an upper layer 32. However, embodiments of the inventive conceptsare not limited thereto. In another embodiment, the third insulatinglayer 30 may have a single-layer structure.

The upper electrode UE may be disposed between the lower layer 31 andthe upper layer 32. The upper electrode UE may overlap with the controlelectrode CE when viewed in a plan view. In the present embodiment, theupper electrode UE may receive the same electrical signal as the controlelectrode CE. Alternatively, the upper electrode UE may receive adifferent electrical signal from that of the control electrode CE andmay function as an electrode of the capacitor CP. However, embodimentsof the inventive concepts are not limited thereto. In anotherembodiment, the upper electrode UE may be omitted in the electronicpanel 200.

The fourth insulating layer 40 may be disposed on the third insulatinglayer 30 to cover the input electrode IE and the output electrode OE. Inanother embodiment, the semiconductor pattern AL may be disposed on thecontrol electrode CE in the thin film transistor TR. In still anotherembodiment, the semiconductor pattern AL may be disposed on the inputelectrode IE and the output electrode OE. In yet another embodiment, theinput electrode IE and the output electrode OE may be disposed on thesame layer as the semiconductor pattern AL and may be connected directlyto the semiconductor pattern AL. The thin film transistor TR accordingto embodiments of the inventive concepts may have any one of variousstructures and is not limited to a specific embodiment.

The light emitting element EE may be disposed on the fourth insulatinglayer 40. The light emitting element EE may include a first electrodeE1, an organic layer EL, and a second electrode E2.

The first electrode E1 may penetrate the fourth insulating layer 40 soas to be connected to the thin film transistor TR. Although not shown inthe drawings, the electronic panel 200 may further include a connectionelectrode disposed between the first electrode E1 and the thin filmtransistor TR. In this case, the first electrode E1 may be electricallyconnected to the thin film transistor TR through the connectionelectrode.

The fifth insulating layer 50 may be disposed on the fourth insulatinglayer 40. The fifth insulating layer 50 may include an organic materialand/or an inorganic material and may have a single-layered ormulti-layered structure. An opening may be defined in the fifthinsulating layer 50. The opening may expose at least a portion of thefirst electrode E1. The fifth insulating layer 50 may be a pixeldefining layer.

The organic layer EL may be disposed between the first electrode E1 andthe second electrode E2. The organic layer EL may include at least oneemission layer. For example, the organic layer EL may include at leastone of material for emitting a red light, a green light, and a bluelight. In an embodiment, the organic layer EL may include a fluorescentmaterial or a phosphorescent material. The organic layer EL may includean organic light emitting material or an inorganic light emittingmaterial. The organic layer EL may emit light in response to a potentialdifference between the first electrode E1 and the second electrode E2.

In the present embodiment, the organic layer EL has a single unitarybody shape overlapping with a plurality of the openings. However,embodiments of the inventive concepts are not limited thereto. Theorganic layer EL may be provided as a plurality of patternscorresponding to the openings, respectively.

Meanwhile, the organic layer EL may further include a charge controllayer in addition to the emission layer. The charge control layer maycontrol movement of charges to improve the luminous efficiency and thelife span of the light emitting element EE. In this case, the organiclayer EL may include at least one of a hole transfer material, a holeinjection material, an electron transfer material, or an electroninjection material.

The second electrode E2 may be disposed on the organic layer EL. Thesecond electrode E2 may be opposite to the first electrode E1. Thesecond electrode E2 may have a single unitary body shape extending fromthe active area AA into the peripheral area NAA. The second electrode E2may be provided in common in a plurality of the pixels PX. The lightemitting element EE of each of the pixels PX may receive a common powersource signal (i.e., the second power source signal) through the secondelectrode E2.

The second electrode E2 may include a transparent conductive material ora semi-transparent conductive material. Thus, light generated from theorganic layer EL may easily exit in the third direction DR3 through thesecond electrode E2. However, embodiments of the inventive concepts arenot limited thereto. In another embodiment, the first electrode E1 mayinclude a transparent or semi-transparent conductive material, and thelight emitting element EE may be driven as a rear surface light emittingtype. In still another embodiment, the light emitting element EE may bedriven as a dual surface light emitting type in which light exitsthrough a front surface and a rear surface.

The encapsulation layer 60 may be disposed on the light emitting elementEE to encapsulate the light emitting element EE. In some embodiments, acapping layer covering the second electrode E2 may be disposed betweenthe second electrode E2 and the encapsulation layer 60.

The encapsulation layer 60 may include a first inorganic layer 61, anorganic layer 62, and a second inorganic layer 63, which are stacked(e.g., sequentially stacked) in the third direction DR3. However,embodiments of the inventive concepts are not limited thereto. Inanother embodiment, the encapsulation layer 60 may further include aplurality of inorganic layers and/or organic layers.

The first inorganic layer 61 may cover the second electrode E2. Thefirst inorganic layer 61 may prevent external moisture and/or oxygenfrom permeating into the light emitting element EE. For example, thefirst inorganic layer 61 may include silicon nitride, silicon oxide,silicon oxynitride, or a combination thereof. The first inorganic layer61 may be formed by a chemical vapor deposition process.

The organic layer 62 may be disposed on the first inorganic layer 61 andmay be in contact with the first inorganic layer 61. The organic layer62 may provide a flat surface on the first inorganic layer 61. Theorganic layer 62 may cover a bent portion of a top surface of the firstinorganic layer 61 and/or a particle existing on the first inorganiclayer 61, and thus it is possible to block the influence of the state ofthe top surface of the first inorganic layer 61 on components formed onthe organic layer 62. In addition, the organic layer 62 may relax orrelease stress between layers being in contact with the organic layer62. The organic layer 62 may include an organic material and may beformed by a solution process such as a spin coating process, a slitcoating process, and/or an inkjet process.

The second inorganic layer 63 may be disposed on the organic layer 62 tocover the organic layer 62. The second inorganic layer 63 may be stablyformed on the top surface of the organic layer 62, which is relativelyflat as compared with the top surface of the first inorganic layer 61.The second inorganic layer 63 may encapsulate moisture outputted fromthe organic layer 62 to prevent the moisture from being provided to theoutside. For example, the second inorganic layer 63 may include siliconnitride, silicon oxide, silicon oxynitride, or a combination thereof.The second inorganic layer 63 may be formed by a chemical vapordeposition process.

In the present embodiment, the hole area HA may include the hole MH anda line area LA. The line area LA may be provided between the hole MH andthe active area AA. The line area LA may surround the hole MH whenviewed in a plan view (e.g., in a direction normal to the front surfaceFS). The light emitting element EE and/or the thin film transistor TRdisposed in the active area AA may be omitted in the line area LA. Thus,the line area LA may have a transmittance higher than that of the activearea AA.

Recess portions GV1, GV2 and GV3, a dam portion DMP and signal lines SL1and SL2 of the display unit 210 may be disposed in the line area LA.

The recess portions GV1, GV2 and GV3 may be spaced apart from eachother. For example, the recess portions GV1, GV2 and GV3 may includefirst to third recess portions GV1, GV2 and GV3 which are formed (e.g.,sequentially formed) along a direction from the active area AA towardthe hole MH. Each of the first to third recess portions GV1, GV2 and GV3may have a closed loop shape surrounding the hole MH in a plan view(e.g., in a direction normal to the front surface FS) or may have anintermittent line shape surrounding at least a portion of the edge ofthe hole MH in a plan view (e.g., in a direction normal to the frontsurface FS).

Each of the recess portions GV1, GV2 and GV3 may be recessed from thetop surface of the base substrate BS. Each of the recess portions GV1,GV2 and GV3 may be formed by removing a portion of the base substrateBS. A deposition pattern ELP may be disposed in each of the recessportions GV1, GV2 and GV3 and may be covered by at least one of thefirst inorganic layer 61 or the second inorganic layer 63.

Because the electronic panel 200 further includes the recess portionsGV1, GV2 and GV3, continuity between the deposition pattern ELP and thelight emitting element EE may be blocked. As a result, a permeating pathof external moisture and/or oxygen may be substantially blocked, andthus damage to the components in the active area AA may be reduced orprevented.

In addition, the deposition patterns ELP in the recess portions GV1, GV2and GV3 may be covered by the first inorganic layer 61 and/or the secondinorganic layer 63, and thus it is possible to prevent the depositionpattern ELP from moving to and affecting other component(s) in a processof manufacturing the electronic panel 200. As a result, processreliability of the electronic panel 200 may be improved. However,embodiments of the inventive concepts are not limited thereto. In otherembodiments, only one of the recess portions GV1, GV2 and GV3 may beprovided, or the recess portions GV1, GV2 and GV3 may be omitted.

The dam portion DMP may be disposed in the line area LA to partition aformation area of the organic layer 62 and to reduce or preventadditional expansion of the organic layer 62. The dam portion DMP may beprovided in plurality, and the plurality of dam portions DMP may bedisposed between the recess portions GV1, GV2 and GV3. The dam portionDMP may have a stack structure including first to third layers P11, P12and P13. However, embodiments of the inventive concepts are not limitedthereto. In another embodiment, the dam portion DMP may have asingle-layer structure.

In an embodiment, the electronic panel 200 may further include aplanarization layer OC. The planarization layer OC may include anorganic material. The planarization layer OC may be disposed in the holearea HA. The planarization layer OC may cover a non-flat surface definedin the hole area HA by the dam portion DMP and/or the recess portionsGV1, GV2 and GV3 and may provide a flat top surface. Thus, the flatsurface may be provided (e.g., stably provided) in an area of the holearea HA, in which the organic layer 62 is not disposed.

The sensing unit 220 may include a plurality of conductive patterns anda plurality of sensing insulating layers 71, 72 and 73. For example, thesensing insulating layers 71, 72 and 73 may include first to thirdsensing insulating layers 71, 72 and 73 stacked (e.g., sequentiallystacked) in the third direction DR3.

The first sensing insulating layer 71 may cover the planarization layerOC. In the present embodiment, the first sensing insulating layer 71 maycover the top surface of the planarization layer OC in the hole area HAand may cover a top surface of the second inorganic layer 63 in theactive area AA. The conductive patterns HCP, HCL (e.g., the crackdetecting line HCL of FIG. 3C), BRH, BP and SP may be disposed on thefirst sensing insulating layer 71.

Each of the second and third sensing insulating layers 72 and 73 mayhave a single unitary body shape overlapping with the hole area HA andthe active area AA. The conductive patterns HCP, HCL, BRH, BP and SP maybe covered by the third sensing insulating layer 73.

Each of the first to third sensing insulating layers 71, 72 and 73 mayinclude an inorganic layer and/or an organic layer. Each of the first tothird sensing insulating layers 71, 72 and 73 is a single layer in thepresent embodiment. Alternatively, each of the first to third sensinginsulating layers 71, 72 and 73 may have a stack structure including aplurality of layers being in contact with each other.

The conductive patterns HCP, HCL, BRH, BP and SP may include the crackdetecting pattern HCP, the crack detecting line HCL, the connection lineBRH, a connection pattern BP, and a sensing pattern SP. At least some ofthe conductive patterns HCP, HCL, BRH, BP and SP may constitute at leastone of the sensing electrodes TE1 and TE2 (see FIG. 3C) and the crackdetecting circuit HCC (see FIG. 3C).

The sensing pattern SP may be disposed in the active area AA. In thepresent embodiment, the sensing pattern SP may form one of the firstmain pattern SP1 (see FIG. 3C), the first adjacent pattern SP1H (seeFIG. 3C), the second main pattern SP2 (see FIG. 3C), or the secondadjacent pattern SP2H (see FIG. 3C).

The connection pattern BP may be disposed in the active area AA. Theconnection pattern BP may be disposed between the first sensinginsulating layer 71 and the second sensing insulating layer 72. Theconnection pattern BP may be disposed on a different layer from a layerat which the sensing pattern SP is disposed.

In the present embodiment, the connection pattern BP may be one of thefirst connection pattern BP1 (see FIG. 3C) and the second connectionpattern BP2 (see FIG. 3C). The sensing pattern SP may be connected tothe connection pattern BP and may be electrically connected to anothersensing pattern adjacent thereto.

In the present embodiment, most of the first and second sensingelectrodes TE1 and TE2 (see FIG. 3C) may be disposed between the secondsensing insulating layer 72 and the third sensing insulating layer 73,and one of the first connection pattern BP1 and the second connectionpattern BP2 may be disposed at a different layer to connect the sensingpatterns adjacent to each other. However, embodiments of the inventiveconcepts are not limited thereto. In another embodiment, the firstsensing electrode TE1 and the second sensing electrode TE2 may bedisposed at different layers.

The crack detecting pattern HCP may be disposed in the hole area HA. Thecrack detecting pattern HCP may be spaced apart from the sensing patternSP. Thus, the crack detecting pattern HCP and the sensing pattern SP mayreceive independent electrical signals of each other. Therefore, thecrack detecting pattern HCP may be operated independently of the sensingpattern SP. In the present embodiment, the crack detecting pattern HCPmay be disposed on the planarization layer OC. The crack detectingpattern HCP may be disposed at the same layer as the sensing pattern SP.The crack detecting pattern HCP may be disposed between the secondsensing insulating layer 72 and the third sensing insulating layer 73.

The crack detecting pattern HCP and the sensing pattern SP may be formedusing one mask at the same time, and thus processes may be simplifiedand process costs may be reduced. However, embodiments of the inventiveconcepts are not limited thereto. In another embodiment, the crackdetecting pattern HCP may be disposed at a different layer from a layerat which the sensing pattern SP is disposed.

The connection line BRH may be disposed on a different layer from thelayer on which the crack detecting pattern HCP is disposed. Theconnection line BRH may be disposed between the first sensing insulatinglayer 71 and the second sensing insulating layer 72. The crack detectingpattern HCP may penetrate the second sensing insulating layer 72 so asto be connected to the connection line BRH. The connection line BRH mayextend into the peripheral area NAA (see FIG. 3C) and may connect thecrack detecting line HCL (see FIG. 3C) and the crack detecting patternHCP.

According to the embodiments of the inventive concepts, the crackdetecting pattern HCP may be disposed in the hole area HA to checkwhether a crack occurs in the hole area HA or not. In addition, becausethe connection line BRH is disposed at a different layer from the layerat which the sensing pattern SP is disposed, it is possible to preventelectrical connection between the connection line BRH and the sensingpattern SP which overlap with each other in a plan view (e.g., in adirection normal to the front surface FS). Thus, the crack detectingpattern HCP may be stably connected to the crack detecting line HCLwithout deformation of the shape of the sensing pattern SP.

FIG. 5A is a plan view illustrating a portion of an electronic panelaccording to an embodiment of the inventive concepts. FIG. 5B is a planview schematically illustrating a crack detecting circuit. Hereinafter,an embodiment of the inventive concepts will be described with referenceto FIGS. 5A and 5B. Meanwhile, the same components as described withreference to FIGS. 1A-4 will be indicated by the same reference numeralsor designators, and the descriptions thereto may be omitted for thepurpose of ease and convenience of description.

FIG. 5A illustrates a portion of the sensing unit 220, which includesthe hole area HA. FIG. 5A may correspond to the area XX′ of FIG. 1B. Asillustrated in FIG. 5A, the first adjacent patterns SP1H and the secondadjacent patterns SP2H may be disposed along the edge of the hole areaHA.

The first adjacent patterns SP1H which are spaced apart from each otherin the second direction DR2 with the hole area HA interposedtherebetween may be connected to each other through a connection patternpassing through the hole area HA. The connection pattern passing throughthe hole area HA is extended along a portion of the hole MH like thesignal lines SL1 and SL2 (e.g., the signal lines SL1 and SL2 of FIG. 3b) and may connect the first adjacent patterns SP1H. Each of the firstadjacent patterns SP1H may be connected to the first main pattern SP1through the first connection pattern BP1.

The second adjacent patterns SP2H, which are spaced apart from eachother in the first direction DR1 with the hole area HA interposedtherebetween, may be connected to each other through another connectionpattern passing through the hole area HA. The connection pattern passingthrough the hole area HA is extended along a portion of the hole MH in asimilar manner as the signal lines SL1 and SL2 and may connect thesecond adjacent patterns SP2H. Each of the second adjacent patterns SP2Hmay be connected to the second main pattern SP2 through the secondconnection pattern BP2.

The connection lines BRH1 and BRH2 may be electrically insulated fromeach other. In the present embodiment, the first adjacent pattern SP1H,the second adjacent pattern SP2H, the first main pattern SP1, the secondmain pattern SP2 and the second connection pattern BP2 may be disposedat the same layer, and the first connection pattern BP1 may be disposedat a different layer from the layer at which the patterns SP1H, SP2H,SP1, SP2 and BP2 are disposed.

The crack detecting pattern HCP of the crack detecting circuit HCC(e.g., the crack detecting circuit HCC of FIG. 5B) may be disposed inthe hole area HA and may have a shape extending along the edge of thehole area HA. The crack detecting pattern HCP may have a single unitarybody shape. The crack detecting pattern HCP may have a shape extendingalong the edge of the hole MH when viewed in a plan view. The crackdetecting pattern HCP may have an open curve shape including both endsseparated from each other.

Meanwhile, a shape of the crack detecting pattern HCP according to thepresent embodiment may be line-symmetrical with respect to a symmetryaxis VL. The symmetry axis VL may be an imaginary line passing through acenter HC of the hole area HA. The crack detecting pattern HCP may havea bilaterally symmetrical shape with respect to the symmetry axis VL.Thus, the symmetry axis VL may be a symmetry axis of the crack detectingpattern HCP.

Referring to FIG. 5B, the crack detecting pattern HCP may include afirst extension portion EX1, a second extension portion EX2, a thirdextension portion EX3, a first connecting portion CP1, a secondconnecting portion CP2, a first protrusion ST1, and a second protrusionST2. The first extension portion EX1, the second extension portion EX2,the third extension portion EX3, the first connecting portion CP1, thesecond connecting portion CP2, the first protrusion ST1 and the secondprotrusion ST2 may be connected to each other to constitute a singleunitary body shape.

The first extension portion EX1 and the second extension portion EX2 mayface each other (e.g., may be opposite each other) with respect to thesymmetry axis VL. Each of the first and second extension portions EX1and EX2 may be disposed in the hole area HA and may extend along theedge of the hole area HA. The first extension portion EX1 and the secondextension portion EX2 may be disposed in the line area LA (e.g., theline area LA of FIG. 4).

The first extension portion EX1 may be disposed at a left side of thesymmetry axis VL, and the second extension portion EX2 may be disposedat a right side of the symmetry axis VL. The first extension portion EX1may have a semicircular shape convex to the left, and the secondextension portion EX2 may have a semicircular shape convex to the right.The first extension portion EX1 and the second extension portion EX2 maybe line-symmetrical with respect to the symmetry axis VL.

The third extension portion EX3 may be spaced apart from the firstextension portion EX1 and the second extension portion EX2. The thirdextension portion EX3 may be closer to the center HC of the hole area HAthan the first extension portion EX1 and the second extension portionEX2.

The third extension portion EX3 may be disposed in the hole area HA andmay extend along the edge of the hole area HA. The third extensionportion EX3 may overlap with the symmetry axis VL when viewed in a planview (e.g., in a direction normal to the front surface FS). The thirdextension portion EX3 may intersect the symmetry axis VL.

The first connecting portion CP1 may connect a first end of the firstextension portion EX1 and a first end of the third extension portionEX3. The second connecting portion CP2 may be spaced apart from thefirst connecting portion CP1 and may connect a first end of the secondextension portion EX2 and a second end of the third extension portionEX3.

The first connecting portion CP1 and the second connecting portion CP2may face each other with the symmetry axis VL interposed therebetween.The first connecting portion CP1 and the second connecting portion CP2may extend in parallel to an extending direction of the symmetry axisVL. In other words, the first connecting portion CP1 and the secondconnecting portion CP2 may be parallel to the symmetry axis VL in thepresent embodiment. The first connecting portion CP1 and the secondconnecting portion CP2 may be line-symmetrical with respect to thesymmetry axis VL.

The first protrusion ST1 may be connected to a second end of the firstextension portion EX1, and the second protrusion ST2 may be connected toa second end of the second extension portion EX2. The first protrusionST1 and the second protrusion ST2 may be line-symmetrical with respectto the symmetry axis VL.

The connection line BRH may connect the crack detecting pattern HCP andthe crack detecting line HCL. The connection line BRH may include afirst connection line BRH1 and a second connection line BRH2. The firstconnection line BRH1 and the second connection line BRH2 may beconnected to different crack detecting lines from each other.

For example, the first connection line BRH1 may connect the firstprotrusion ST1 of the crack detecting pattern HCP and a first crackdetecting line HCL1. The second connection line BRH2 may connect thesecond protrusion ST2 of the crack detecting pattern HCP and a secondcrack detecting line HCL2.

However, embodiments of the inventive concepts are not limited thereto.In another embodiment, at least one of the protrusions ST1 and ST2 maybe omitted in the crack detecting circuit HCC. In this case, the firstconnection line BRH1 or the second connection line BRH2 may be connecteddirectly to the first extension portion EX1 or the second extensionportion EX2.

In the present embodiment, the first and second connection lines BRH1and BRH2 may be disposed on a different layer from a layer on which thecrack detecting pattern HCP and the crack detecting line HCL aredisposed. Thus, contact portions CTP1, CTL1, CTP2 and CTL2 may be formedbetween the first connection line BRH1 and the first protrusion ST1,between the first connection line BRH1 and the first crack detectingline HCL1, between the second connection line BRH2 and the secondprotrusion ST2, and between the second connection line BRH2 and thesecond crack detecting line HCL2.

An input signal received from a first end of the first crack detectingline HCL1 may be provided into the crack detecting pattern HCP throughthe first connection line BRH1 and the first protrusion ST1, may passthrough the first extension portion EX1, the first connecting portionCP1, the third extension portion EX3, the second connecting portion CP2,and the second extension portion EX2, may be outputted from the crackdetecting pattern HCP through the second protrusion ST2, and then, maybe outputted to a first end of the second crack detecting line HCL2 viathe second connection line BRH2.

An input signal received from a second end of the second crack detectingline HCL2 may be provided into the crack detecting pattern HCP throughthe second connection line BRH2 and the second protrusion ST2, may passthrough the second extension portion EX2, the second connecting portionCP2, the third extension portion EX3, the first connecting portion CP1,and the first extension portion EX1, may be outputted from the crackdetecting pattern HCP through the first protrusion ST1, and then, may beoutputted to a second end of the first crack detecting line HCL1 via thefirst connection line BRH1.

Damage of the crack detecting pattern HCP and/or the crack detectingline HCL may be checked or determined using a signal outputted throughthe first end of the second crack detecting line HCL2 and a signaloutputted through the other end of the first crack detecting line HCL1.Thus, it is possible to easily sense an occurrence or nonoccurrence of acrack in the hole area HA and/or an occurrence or nonoccurrence of acrack in the peripheral area NAA. As a result, the reliability of theelectronic panel 200 may be improved.

While a crack detecting signal is provided to the crack detectingpattern HCP, currents in opposite directions may flow through the firstand third extension portions EX1 and EX3 adjacent to each other, throughthe second and third extension portions EX2 and EX3 adjacent to eachother, and through the first and second connecting portions CP1 and CP2adjacent to each other. For example, when the input signal is providedthrough the first crack detecting line HCL1, a direction of the currentpassing through the first and second extension portions EX1 and EX2 maybe a counterclockwise direction with respect to the center HC of thehole area HA, and a direction of the current passing through the thirdextension portion EX3 may be a clockwise direction with respect to thecenter HC of the hole area HA. In addition, a direction of the currentpassing through the first connecting portion CP1 may be the seconddirection DR2, and a direction of the current passing through the secondconnecting portion CP2 may be an opposite direction to the seconddirection DR2.

Thus, a parasitic capacitance may increase as a distance D1 between thefirst and second protrusions ST1 and ST2 adjacent to each otherdecreases, a parasitic capacitance may increase as a distance D2 betweenthe first and third extension portions EX1 and EX3 adjacent to eachother decreases, and a parasitic capacitance may increase as a distanceD3 between the second and third extension portions EX2 and EX3 adjacentto each other decreases. Electrical interference between the input andoutput signals may decrease as the distance D1 between the first andsecond protrusions ST1 and ST2 increases, and thus electricalreliability may be improved.

In addition, the distance D2 between the first and third extensionportions EX1 and EX3 may be designed to be substantially equal to thedistance D3 between the second and third extension portions EX2 and EX3,and thus the parasitic capacitance occurring at a left side of thesymmetry axis VL may be substantially equal to the parasitic capacitanceoccurring at a right side of the symmetry axis VL.

According to the embodiments of the inventive concepts, the crackdetecting pattern HCP may have the line-symmetrical shape with respectto the symmetry axis VL. Thus, a resistance of the crack detectingpattern HCP at the left side of the symmetry axis VL may besubstantially equal to a resistance of the crack detecting pattern HCPat the right side of the symmetry axis VL when the first protrusion ST1is used as the input terminal or when the second protrusion ST2 is usedas the input terminal. As a result, occurrence of static electricity inthe crack detecting pattern HCP may be reduced and damage of the crackdetecting pattern HCP caused by the static electricity may be inhibitedor prevented. Accordingly, the reliability of the electronic panel 200may be improved.

According to the embodiments of the inventive concepts, the electronicpanel 200 may include the crack detecting pattern HCP having theline-symmetrical shape with respect to the symmetry axis VL. Thesymmetry axis VL may pass through the center HC of the hole area HA andmay pass between the first and second protrusions ST1 and ST2functioning as the input/output terminals of the crack detecting patternHCP.

Thus, an occurrence or nonoccurrence of a crack in the electronic panel200 may be easily inspected or checked without an additional apparatus.In addition, the occurrence of the static electricity in the crackdetecting pattern HCP may be reduced, and thus the electricalreliability may be improved.

FIGS. 6A-6C are plan views illustrating crack detecting patternsaccording to some embodiments of the inventive concepts. Hereinafter,embodiments of the inventive concepts will be described with referenceto FIGS. 6A-6C. Meanwhile, the same components as described withreference to FIGS. 1A-5B will be indicated by the same referencenumerals or designators, and the descriptions thereof may be omitted forthe purpose of ease and convenience in description.

According to an embodiment of the inventive concepts, each of the firstextension portion EX1, the second extension portion EX2, the firstconnecting portion CP1 and the second connecting portion CP2 of thecrack detecting pattern HCP of FIG. 5B may be provided in plurality.Thus, a crack detecting pattern having a density higher than that of thecrack detecting pattern HCP of FIG. 5B may be designed.

For example, as illustrated in FIG. 6A, a crack detecting pattern HCP-1may include a plurality of first extension portions EX11 and EX12, aplurality of second extension portions EX21 and EX22, a plurality offirst connecting portions CP11 and CP12, and a plurality of secondconnecting portions CP21 and CP22. One of the first connecting portionsCP11 and CP12 (e.g., the first connecting portion CP11) may connect thefirst extension portions EX11 and EX12 (e.g., the first extensionportion EX11), and the other thereof (e.g., the first connecting portionCP12) may connect one of the first extension portions EX11 and EX12(e.g., the first extension portion EX12) to the third extension portionEX3. One of the second connecting portions CP21 and CP22 (e.g., thesecond connecting portion CP21) may connect the second extensionportions EX21 and EX22, and the other thereof (e.g., the secondconnection portion CP22) may connect one of the second extensionportions EX21 and EX22 (e.g., the second extension portion EX22) to thethird extension portion EX3.

The first extension portions EX11 and EX12 may be spaced apart from eachother at substantially the same distance, and the second extensionportions EX21 and EX22 may be spaced apart from each other atsubstantially the same distance. The first extension portions EX11 andEX12 and the second extension portions EX21 and EX22 may beline-symmetrical with respect to the symmetry axis VL. The firstconnecting portions CP11 and CP12 and the second connecting portionsCP21 and CP22 may be line-symmetrical with respect to the symmetry axisVL.

Referring to FIG. 6B, a crack detecting circuit HCC-2 may include acrack detecting pattern HCP-2 which has a greater area (or size) thanthe crack detecting pattern HCP-1 of the crack detecting circuit HCC-1of FIG. 6A. The crack detecting pattern HCP-2 may include three firstextension portions EX11, EX12 and EX13, three second extension portionsEX21, EX22 and EX23, three first connecting portions CP11, CP12 andCP13, and three second connecting portions CP21, CP22 and CP23.

The first extension portion EX11 and the second extension portion EX21of the first extension portions EX11, EX12 and EX13 and the secondextension portions EX21, EX22 and EX23, which are disposed outermostfrom the center HC of the hole area HA, may be connected to the firstprotrusion ST1 and the second protrusion ST2, respectively. The firstextension portion EX13 and the second extension portion EX23 of thefirst extension portions EX11, EX12 and EX13 and the second extensionportions EX21, EX22 and EX23, which are closest to the center HC of thehole area HA, may be connected to the third extension portion EX3.

One of the first connecting portions CP11, CP12 and CP13 (e.g., thefirst connecting portion CP11) may connect one of the first extensionportions EX11, EX12 and EX13 (e.g., the first extension portion EX11) toanother of the first extension portions EX11, EX12 and EX13 (e.g., thefirst extension portion EX12). Another of the first connecting portionsCP11, CP12 and CP13 (e.g., the first connecting portion CP12) mayconnect another of the first extension portions EX11, EX12 and EX13(e.g., the first extension portion EX12) to the other of the firstextension portions EX11, EX12 and EX13 (first extension portion EX13).The other of the first connecting portions CP11, CP12 and CP13 (e.g.,the first connecting portion CP13) may connect the other of the firstextension portions EX11, EX12 and EX13 (e.g., the first extensionportion EX13) to the third extension portion EX3.

One of the second connecting portions CP21, CP22 and CP23 (e.g., thesecond connecting portion CP21) may connect one of the second extensionportions EX21, EX22 and EX23 (e.g., the second extension portion EX21)to another of the second extension portions EX21, EX22 and EX23 (e.g.,the second extension portions EX22). Another of the second connectingportions CP21, CP22 and CP23 (e.g., the second connecting portion CP22)may connect another of the second extension portions EX21, EX22 and EX23(e.g., the second extension portion EX22) to the other of the secondextension portions EX21, EX22 and EX23 (e.g., the second extensionportion EX23). The other of the second connecting portions CP21, CP22and CP23 (e.g., the second connecting portion CP23) may connect theother of the second extension portions EX21, EX22 and EX23 (e.g., thesecond extension portion EX23) to the third extension portion EX3.

The first extension portions EX11, EX12 and EX13 and the secondextension portions EX21, EX22 and EX23 may be line-symmetrical withrespect to the symmetry axis VL. In addition, the first connectingportions CP11, CP12 and CP13 and the second connecting portions CP21,CP22 and CP23 may be line-symmetrical with respect to the symmetry axisVL. Thus, the crack detecting pattern HCP-2 may have a line-symmetricalshape with respect to the symmetry axis VL.

Referring to FIG. 6C, a crack detecting circuit HCC-3 may include acrack detecting pattern HCP-3 having a greater area (or size) than thecrack detecting pattern HCP-2 of the crack detecting circuit HCC-2 ofFIG. 6B. The crack detecting pattern HCP-3 may include four firstextension portions EX11, EX12, EX13 and EX14, four second extensionportions EX21, EX22, EX23 and EX24, four first connecting portions CP11,CP12, CP13 and CP14, and four second connecting portions CP21, CP22,CP23 and CP24.

The first extension portion EX11 and the second extension portion EX21of the first extension portions EX11 to EX14 and the second extensionportions EX21 to EX24, which are disposed outermost from the center HCof the hole area HA, may be connected to the first protrusion ST1 andthe second protrusion ST2, respectively. The first extension portionEX14 and the second extension portion EX24 of the first extensionportions EX11 to EX14 and the second extension portions EX21 to EX24,which are closest to the center HC of the hole area HA, may be connectedto the third extension portion EX3.

The first connecting portions CP11, CP12, CP13 and CP14 may be connectedbetween the first extension portions EX11, EX12, EX13 and EX14 and thethird extension portion EX3, respectively. The second connectingportions CP21, CP22, CP23 and CP24 may be connected between the secondextension portions EX21, EX22, EX23 and EX24 and the third extensionportion EX3, respectively.

The first extension portions EX11, EX12, EX13 and EX14 and the secondextension portions EX21, EX22, EX23 and EX24 may be line-symmetricalwith respect to the symmetry axis VL. In addition, the first connectingportions CP11, CP12, CP13 and CP14 and the second connecting portionsCP21, CP22, CP23 and CP 24 may be line-symmetrical with respect to thesymmetry axis VL. Thus, the crack detecting pattern HCP-3 may have aline-symmetrical shape with respect to the symmetry axis VL.

FIG. 7A is an exploded perspective view illustrating an electronicapparatus according to an embodiment of the inventive concepts. FIG. 7Bis a plan view illustrating some components of FIG. 7A. FIG. 7Bschematically illustrates a crack detecting circuit for the purpose ofease and convenience in description and illustration. Hereinafter, anembodiment of the inventive concepts will be described with reference toFIGS. 7A and 7B. Meanwhile, the same components as described withreference to FIGS. 1A to 6C will be indicated by the same referencenumerals or designators, and the descriptions thereto may be omitted forthe purpose of ease and convenience in description.

As illustrated in FIG. 7A, an electronic apparatus EA_P may include anelectronic panel 200_P and a plurality of electronic modules 300_P.Except that the electronic panel 200_P includes a plurality of holeareas HA1 and HA2, the electronic apparatus EA_P may substantiallycorrespond to the electronic apparatus EA illustrated in FIG. 1B.Hereinafter, duplicated descriptions may be omitted.

The plurality of hole areas HA1 and HA2 may include a first hole areaHA1 and a second hole area HA2. The first hole area HA1 and the secondhole area HA2 may be spaced apart from each other along the firstdirection DR1. A first hole MH1 and a second hole MH2 which penetratethe electronic panel 200_P may be defined in the first hole area HA1 andthe second hole area HA2, respectively.

The electronic modules 300_P may include a first module 310 and a secondmodule 320. Each of the first and second modules 310 and 320 may includeat least one of the components of the electronic modules EM1 and EM2described above.

Referring to FIG. 7B, the electronic panel 200_P may include a crackdetecting circuit HCC-P for sensing or checking whether a crack occursin the hole areas HA1 and HA2. The crack detecting circuit HCC-P mayinclude a first crack detecting pattern HCP1 disposed in the first holearea HA1 and a second crack detecting pattern HCP2 disposed in thesecond hole area HA2. The first crack detecting pattern HCP1 may have abilaterally symmetrical shape with respect to a first symmetry axis VL1passing through a center HC1 of the first hole area HA1. The secondcrack detecting pattern HCP2 may have a bilaterally symmetrical shapewith respect to a second symmetry axis VL2 passing through a center HC2of the second hole area HA2.

A shape of each of the first and second crack detecting patterns HCP1and HCP2 corresponds to the shape of the crack detecting pattern HCP ofFIG. 5A in the present embodiment. However, embodiments of the inventiveconcepts are not limited thereto. In certain embodiments, the shapes ofthe first and second crack detecting patterns HCP1 and HCP2 may bevariously designed or modified under the condition that the first andsecond crack detecting patterns HCP1 and HCP2 have line-symmetricalshapes with respect to the first and second symmetry axes VL1 and VL2,respectively. In addition, the first and second crack detecting patternsHCP1 and HCP2 may have the same shape in the present embodiment.Alternatively, the first and second crack detecting patterns HCP1 andHCP2 may have different shapes.

Crack detecting lines connected to the first crack detecting patternHCP1 may be different from crack detecting lines connected to the secondcrack detecting pattern HCP2. The first crack detecting pattern HCP1 maybe connected to a first crack detecting line HCL1P through a firstconnection line BRH11 and may be connected to a second crack detectingline HCL2P through a second connection line BRH12. The second crackdetecting pattern HCP2 may be connected to a third crack detecting lineHCL3P through a third connection line BRH21 and may be connected to afourth crack detecting line HCL4P through a fourth connection lineBRH22.

According to the embodiment of the inventive concepts, the electronicpanel 200_P may include the first crack detecting pattern HCP1 and thesecond crack detecting pattern HCP2 separated from each other, and thusit is possible to check or determine whether a crack has occurred ineach of the first and second hole areas HA1 and HA2 or not. In addition,according to the embodiment of the inventive concepts, the first andsecond crack detecting patterns HCP1 and HCP2 may be designed to havethe line-symmetrical shapes with respect to the first and secondsymmetry axes VL1 and VL2, respectively, and thus it is possible toinhibit or prevent the first and second crack detecting patterns HCP1and HCP2 from being damaged by an occurrence of a discharge of staticelectricity. As a result, reliability of the electronic apparatus EA_Pmay be improved.

FIG. 8 is an exploded perspective view illustrating an electronicapparatus according to an embodiment of the inventive concepts. FIG. 9Ais a plan view illustrating a portion of FIG. 8. FIG. 9B is across-sectional view taken along the line I-I′ of FIG. 9A. Hereinafter,an embodiment of the inventive concepts will be described with referenceto FIGS. 8-9B. Meanwhile, the same components as described withreference to FIGS. 1A-7B will be indicated by the same referencenumerals or designators, and the descriptions thereto may be omitted forthe purpose of ease and convenience in description.

As illustrated in FIG. 8, a hole MH may be defined adjacent to theperipheral area NAA in an electronic apparatus EA_E. Thus, in a frontsurface IS-E of an electronic panel 200_E, a hole area HA_E may bedefined at a position adjacent to both the peripheral area NAA and theactive area AA.

Shapes of a transmission area TA-E and a bezel area BZA-E of a frontsurface FS-E of the window 100 may correspond to shapes of the activearea AA and the peripheral area NAA. The transmission area TA-E maycover the active area AA, and the bezel area BZA-E may cover theperipheral area NAA and the hole active area HA_E. An open portion HHcorresponding to the hole MH may be defined in the bezel area BZA-E.

Referring to FIG. 9A, the hole area HA_E may be disposed in the activearea AA and may be surrounded by one first adjacent pattern SP1H, twosecond adjacent patterns SP2H, and the peripheral area NAA. The crackdetecting pattern HCP may be disposed in the hole area HA_E and mayextend along the edge of the hole MH. The crack detecting pattern HCPmay have a line-symmetrical shape with respect to a symmetry axis VLpassing through a center HC of the hole area HA_E.

The connection lines BRH1 and BRH2 may connect both ends of the crackdetecting pattern HCP to the crack detecting lines HCL1 and HCL2,respectively. The crack detecting lines HCL1 and HCL2 may be disposedadjacent to a side surface of the electronic panel 200_E, and aplurality of sensing lines TL may be arranged in the second directionDR2 between the active area AA and the crack detecting lines HCL1 andHCL2. The sensing lines TL may be spaced apart from each other.

The connection lines BRH1 and BRH2 may cross over the sensing lines TLand may be connected to the corresponding crack detecting lines HCL1 andHCL2, respectively. In the present embodiment, the connection lines BRH1and BRH2 and the crack detecting pattern HCP may be disposed at the samelayer. The connection lines BRH1 and BRH2 and the crack detectingpattern HCP may be formed in a single unitary body or may besequentially formed and be partially stacked.

The sensing lines TL and the first crack detecting line HCL1 may overlapwith but be electrically insulated from at least one of the connectionlines BRH1 and BRH2, which transmits a different signal from theirsignals. Referring to FIG. 9B, each of the sensing lines TL may have adouble layer structure including a first line portion L1 and a secondline portion L2. Thus, electrical resistances of the sensing lines TLmay be reduced.

The first line portion L1 may be disposed between the first sensinginsulating layer 71 and the second sensing insulating layer 72, and thesecond line portion L2 may be disposed between the second sensinginsulating layer 72 and the third sensing insulating layer 73. The firstline portion L1 and the second line portion L2 may penetrate the secondsensing insulating layer 72 so as to be connected to each other.

In the present embodiment, the first connection line BRH1, the secondconnection line BRH2, the crack detecting pattern HCP and the crackdetecting lines HCL1 and HCL2 may be disposed at the same layer. In thepresent embodiment, the second connection line BRH2, the crack detectingpattern HCP and the second crack detecting line HCL2 may be connected toeach other to constitute a single unitary body shape. However,embodiments of the inventive concepts are not limited thereto. Inanother embodiment, the second connection line BRH2 may be stackeddirectly on the crack detecting pattern HCP and the second crackdetecting line HCL2.

The second line portions L2 of the sensing lines TL may be removed in anarea overlapping with the second connection line BRH2. Thus, the firstline portion L1 may overlap with the second connection line BRH2 in aplan view, but the second line portion L2 may be spaced apart from thesecond connection line BRH2. Therefore, electrical connection betweenthe sensing lines TL and the connection lines BRH1 and BRH2 may beprevented.

According to the embodiment of the inventive concepts, the crackdetecting pattern HCP and the connection lines BRH1 and BRH2 may bedisposed at the same layer. Thus, the crack detecting pattern HCP andthe connection lines BRH1 and BRH2 may be formed using one mask at thesame time, and thus processes may be simplified and process costs may bereduced. In addition, according to the embodiment of the inventiveconcepts, the crack detecting pattern HCP may be stably designed eventhough the hole area HA_E is defined adjacent to the peripheral areaNAA, and thus reliability of the electronic panel 200_E may be improved.

FIG. 10A is an exploded perspective view illustrating an electronicapparatus according to an embodiment of the inventive concepts. FIG. 10Bis a plan view schematically illustrating an area YY′ of FIG. 10A. FIGS.11A and 11B are cross-sectional views illustrating electronic panelsaccording to some embodiments of the inventive concepts. FIGS. 11A and11B illustrate areas corresponding to FIG. 4. Hereinafter, embodimentsof the inventive concepts will be described with reference to FIGS.10A-11B. Meanwhile, the same components as described with reference toFIGS. 1A-9B will be indicated by the same reference numerals ordesignators, and the descriptions thereto may be omitted for the purposeof ease and convenience of description.

In an electronic apparatus EA-A according to an embodiment of theinventive concepts, the hole MH of FIG. 1B may be omitted. A hole areaHA may include a module area MA and a line area LA.

The line area LA may be defined along an edge of the module area MA. Theline area LA may surround the edge of the module area MA when viewed ina plan view (e.g., in a direction normal to the front surface FS). Thehole area HA may correspond to an area including the module area MA andthe line area LA.

An external signal inputted to the electronic module 400 and/or a signaloutputted from the electronic module 400 may be transmitted through themodule area MA.

A transmittance of the module area MA may be higher than a transmittanceof an area of the active area AA in which the pixels PX are disposed.The electronic module 400 may sense an external object through themodule area MA and/or may easily provide an outputted optical signal tothe outside through the module area MA.

In the present embodiment, the module area MA may have a shapecorresponding to the shape of the hole MH described above. For example,the module area MA may have a circular shape, an elliptical shape, apolygonal shape, a polygonal shape of which at least one side is curved,or any other suitable shape when viewed in a plan view (e.g., in adirection normal to the front surface FS).

At least one non-light emitting pixel NPX may be disposed in the modulearea MA according to the present embodiment. In FIG. 10B, two non-lightemitting pixels NPX and two pixels PX are illustrated for the purpose ofease and convenience of description and illustration. A lighttransmittance of the non-light emitting pixel NPX may be higher thanthat of the pixel PX. The non-light emitting pixel NPX may be formed byremoving at least a portion of the components of the pixel PX.

For example, the non-light emitting pixel NPX may be formed by removingthe thin film transistor TR of the pixel PX. In other embodiments, thenon-light emitting pixel NPX may be formed by removing the organic layerEL of the components of the pixel PX, by removing one or some componentsof the thin film transistor TR, or by removing only the first electrodeE1 of the components of the pixel PX. In still other embodiments, thenon-light emitting pixel NPX may be formed by removing all of thecomponents of the pixel PX. In this case, the non-light emitting pixelNPX may be defined as a portion in which insulating layers are stacked.

The non-light emitting pixel NPX may be variously modified under thecondition that the transmittance of the non-light emitting pixel NPX ishigher than that of the pixel PX. In addition, the module area MA mayhave a plurality of the pixels PX and one non-light emitting pixel NPXor may have only a plurality of the non-light emitting pixels NPX, aslong as the transmittance of the module area MA is higher than that of asurrounding area.

For example, as illustrated in FIG. 11A, the module area MA may beformed by removing the thin film transistor TR and the first electrodeE1 of the pixel PX. The insulating layers may extend (e.g., continuouslyextend) in the module area MA.

In the hole area HA, the base substrate BS, the first to fifthinsulating layers 10, 20, 30, 40 and 50, the organic layer EL, theencapsulation layer 60 and the sensing insulating layers 71, 72 and 73may not be cut and may overlap with the module area MA. The basesubstrate BS, the first to fifth insulating layers 10, 20, 30, 40 and50, the organic layer EL, the encapsulation layer 60 and the sensinginsulating layers 71, 72 and 73 may be fully formed in the active areaAA via the module area MA.

In the present embodiment, the second electrode E2 may also overlap withthe module area MA. When the second electrode E2 is formed as atransparent or semi-transparent electrode, the module area MA having ahigher transmittance than that of the area in which the pixel PX isdisposed may be formed even though the second electrode E2 overlaps withthe module area MA.

The crack detecting pattern HCP may be disposed in the line area LA andmay surround the edge of the module area MA when viewed in a plan view(e.g., in a direction normal to the front surface SF). Because the crackdetecting pattern HCP is disposed along the edge of the module area MA,a reduction in transmittance of the module area MA may be prevented.

In another embodiment, the second electrode E2 may be removed in themodule area MA, as illustrated in FIG. 11B. An end portion E2-E whichdefines an opening overlapping with the module area MA may be formed atthe second electrode E2.

Thus, even though the second electrode E2 is formed as a non-transparentelectrode, the module area MA having an improved transmittance may beprovided. In addition, even though the second electrode E2 is formed asa semi-transparent electrode, the module area MA having a highertransmittance than that of the module area MA of FIG. 11A may beprovided.

According to the embodiments of the inventive concepts, an electronicmodule not requiring a high transmittance (e.g., an electronic moduleusing infrared light) may easily transmit/receive a signal to/from theoutside through the module area MA formed by removing opaque components.Even though the electronic module 400 overlaps with the electronic panel200-A1 of FIG. 11A or 200-A2 of FIG. 11B, signal input/output with theoutside may be stably performed. In addition, the electronic module 400may be covered by the electronic panel 200-A1 or 200-A2, and thus theelectronic module 400 may be stably protected from an external impactand/or an external contaminant.

According to the embodiments of the inventive concepts, it is possibleto easily check or determine whether a crack occurs in the electronicpanel or not. In addition, electrical damage of the circuit for sensinga crack may be prevented. As a result, the reliability of the electronicpanel may be improved.

While the inventive concepts have been described with reference toexample embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the spirits and scopes of the inventive concepts. Therefore, itshould be understood that the above embodiments are not limiting, butillustrative. Thus, the scopes of the inventive concepts are to bedetermined by the broadest reasonable interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing description.

What is claimed is:
 1. An electronic panel comprising: a base substratehaving a first area, a second area adjacent to the first area, and athird area adjacent to the second area; a plurality of pixels in thesecond area; a plurality of pixel signal lines in the third area andconnected to the pixels; a crack detecting pattern spaced apart from thepixels and in the first area; a first line which is spaced apart fromthe pixel signal lines, located in the third area, and connected to aportion of the crack detecting pattern; and a second line which isspaced apart from the pixel signal lines, located in the third area,connected to another portion of the crack detecting pattern, and spacedapart from the first line, wherein the crack detecting pattern has aline-symmetrical shape with respect to a symmetry axis passing through acenter of the first area.
 2. The electronic panel of claim 1, whereinthe first area comprises a module area and a line area around the modulearea, wherein the crack detecting pattern comprises: a first extensionportion in the line area, the first extension portion extending along anedge of the module area, and being located at a left side of thesymmetry axis; a second extension portion in the line area, the secondextension portion extending along the edge of the module area, beingspaced apart from the first extension portion, and being located at aright side of the symmetry axis; a third extension portion in the linearea, the third extension portion extending along the edge of the modulearea, being spaced apart from the first and second extension portions,and crossing the symmetry axis; and a first connecting portion and asecond connecting portion that are connected to a first end of the firstextension portion and a first end of the second extension portion,respectively, and are symmetrical with respect to the symmetry axis. 3.The electronic panel of claim 2, wherein the first connecting portionand the second connecting portion are parallel to the symmetry axis. 4.The electronic panel of claim 2, wherein a first end of the thirdextension portion is connected to the first connecting portion, and asecond end of the third extension portion is connected to the secondconnecting portion.
 5. The electronic panel of claim 2, wherein thefirst extension portion comprises a plurality of first extensionportions spaced apart from each other, and the second extension portioncomprises a plurality of second extension portions spaced apart fromeach other, wherein the first connecting portion comprises a pluralityof first connecting portions spaced apart from each other and connectedto the first extension portions, respectively, and wherein the secondconnecting portion comprises a plurality of second connecting portionsspaced apart from each other and connected to the second extensionportions, respectively.
 6. The electronic panel of claim 5, wherein oneof the first connecting portions is connected to a first end of thethird extension portion, and one of the second connecting portions isconnected to a second end of the third extension portion.
 7. Theelectronic panel of claim 6, wherein the first connecting portions arespaced apart from each other along a direction parallel to the symmetryaxis, and wherein the second connecting portions are spaced apart fromeach other along the direction parallel to the symmetry axis.
 8. Theelectronic panel of claim 7, wherein the first connecting portions andthe second connecting portions are symmetrical with respect to thesymmetry axis.
 9. The electronic panel of claim 7, wherein the firstconnecting portions are aligned with each other along the directionparallel to the symmetry axis, and wherein the second connectingportions are aligned with each other along the direction parallel to thesymmetry axis.
 10. The electronic panel of claim 2, further comprising:a hole defined in the module area and penetrating the electronic panel,wherein the crack detecting pattern is located along an edge of thehole.
 11. The electronic panel of claim 2, further comprising: at leastone non-light emitting pixel on the module area, wherein the non-lightemitting pixel has a shape obtained by removing at least one ofcomponents of the pixel.
 12. The electronic panel of claim 1, whereinthe crack detecting pattern has an open curve shape including a firstend and a second end.
 13. The electronic panel of claim 12, furthercomprising: a first connection line connecting the first line and thefirst end of the crack detecting pattern; and a second connection lineconnecting the second line and the second end of the crack detectingpattern, wherein the symmetry axis passes between the first connectionline and the second connection line.
 14. An electronic apparatuscomprising: an electronic panel configured to display an image and tosense an external input; and an electronic module overlapping with theelectronic panel, wherein the electronic panel comprises: a basesubstrate having: a hole area in which a hole is defined; an active areaadjacent to the hole area; and a peripheral area adjacent to the activearea; and a crack detecting circuit comprising: a crack detectingpattern in the hole area and having an open curve shape along an edge ofthe hole; a first crack detecting line in the peripheral area andconnected to a first end of the crack detecting pattern; and a secondcrack detecting line spaced apart from the first crack detecting line,in the peripheral area, and connected to a second end of the crackdetecting pattern, wherein the crack detecting pattern has aline-symmetrical shape with respect to a symmetry axis passing through acenter of the hole area.
 15. The electronic apparatus of claim 14,wherein the crack detecting pattern has a single unitary body shape. 16.The electronic apparatus of claim 15, wherein the crack detectingpattern comprises: a first extension portion at a left side of thesymmetry axis; a second extension portion at a right side of thesymmetry axis; a third extension portion crossing the symmetry axis; afirst connecting portion connecting the first extension portion and afirst end of the third extension portion; and a second connectingportion connecting the second extension portion and a second end of thethird extension portion, wherein the first extension portion and thesecond extension portion are spaced apart from each other with thesymmetry axis interposed therebetween and are line-symmetrical withrespect to the symmetry axis, and wherein the first connecting portionand the second connecting portion are spaced apart from each other withthe symmetry axis interposed therebetween and are line-symmetrical withrespect to the symmetry axis.
 17. The electronic apparatus of claim 16,wherein a minimum distance between the third extension portion and thefirst extension portion is substantially equal to a minimum distancebetween the third extension portion and the second extension portion.18. The electronic apparatus of claim 14, wherein the crack detectingcircuit further comprises: a first connection line connecting the firstend of the crack detecting pattern and the first crack detecting line;and a second connection line connecting the second end of the crackdetecting pattern and the second crack detecting line, wherein thesymmetry axis passes between the first connection line and the secondconnection line.
 19. The electronic apparatus of claim 18, wherein thefirst connection line and the second connection line are connected tothe first crack detecting line and the second crack detecting line viathe active area.
 20. The electronic apparatus of claim 14, wherein theelectronic panel further comprises: a plurality of sensing electrodes inthe active area and comprising: a sensing insulating layer; firstconductive patterns under the sensing insulating layer; and secondconductive patterns at the sensing insulating layer, wherein the crackdetecting pattern is at the same layer as the second conductivepatterns.